MIGDAL HAEMEK, Israel, July 3, 2014
Jordan Valley Semiconductors Ltd., a leading supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (µXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by another leading memory player. The tool provides fully automated metrology solutions for several key applications, including single µ-bump chemical composition and height measurements, as well as control of multi-layer Under Bump Metallization (UBM) stack deposition.
Isaac Mazor, Jordan Valley's CEO, said: "We are glad to add another leading memory customer to our distinguished list of advanced customers. This is additional proof that Jordan Valley's tool and technology superiority is well appreciated and serves leading companies in the industry. Advancements in WLP technologies, such as the scaling down of solder bumps, complex UBM stacks, etc., set new metrology challenges and requirements that Jordan Valley can address. We believe that our tools will further contribute to our customer's high yield targets in the current and future WLP process."
Jordan Valley's micro-XRF metrology tool is the "tool of record" for single bump composition measurements. It is ideal for non-destructive, in-line µ-bump %Ag measurements and uses a vertical excitation geometry that provides the smallest beam footprint with no dependence on height variation. The tool provides information critical for WLP process control, and comes with fully automated recipe driven measurements and analysis capabilities, advanced navigation algorithms for measurement on product wafers and more.
We are very happy to inform you about the latest development of Mechanical Devices:
New Generation Plungers (NG Plungers)
The New Generation Device plungers were designed for Flex-TC were designed to be strong, reliable with better performance. to be strong, reliable with better performance.
The manufacturer Epoxy Technology Inc. and John P. Kummer Group are pleased to announce the successful completion of ISO 10993 certification of further 3 high-performance adhesives from their product range of biocompatible adhesives, which additionally already hold the USP Class VI classification.
EPO -TEK 377 ® is an optical two - component epoxy resin and as a result of its´ low viscosity and heat resistance, an optimum potting material, that is especially well suitable for optical and medical applications.
A thermosetting system was developed with EPO-TEK ® OD2002. This adhesive is a further advancement of the 353ND-4 and 364. It´s main features are: high Tg (glass transition temperature) of 140 °C, an outstanding strength and excellent moisture/ chemical resistance. The OD2002 is suitable for all conventional sterilization methods such as: ETO, Sterrad, x -ray and autoclaving.
For applications, in which a very quick fixing for manufacturing is required, EPO-TEK OG116 -31 ® is to be recommended. It is an UV-curing 1-component epoxy adhesive that can be thermally post-cured and due to its´ high Tg and low outgassing is particularly suitable at high temperatures.
VLSI Standards, Inc. was founded in 1984 in Mountain View, California for the purpose of developing measurement standards and associated services for the semiconductor and related industries. VLSI Standards' first products were a traceable Step Height Standard, and a line of Contamination Standards. Today, VLSI Standards provides dozens of standards, products, and services to address every aspect of instrument calibration in the semiconductor and other industries requiring accurate metrology.
As of 14/01/01, John P. Kummer GmbH represents VLSI Standards, Inc. beside Germany, Austria and The Netherlands in the following countries:
- Czech Republic
John P. Kummer AG distributes the products from VLSI Standards, Inc. in Switzerland from 14/01/01.
We would like to thank VLSI for the trust in our cooperation and the extension of the distribution territory!
We really enjoyed our "get together"!