A Key Feature of our ASAP-1 IPS System has been the ALWAYS LIVE MACHINE VISION screen which enables the user to make REALTIME processing decisions. This feature is becoming more and more crucial with the move to ever thinner silicon, and the complexities of modern mechanical decapsulation.
We are pleased to point out that we are going to be upgrading the MACHINE VISION camera on all machines we build. This has the effect of achieving a much better quality image for the user to align cavity/die size with.
MIGDAL HAEMEK, Israel, July 7, 2014
Jordan Valley Semiconductors Ltd., a leading supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that it has recently delivered and successfully commissioned its JVX7300L in-line X-ray metrology tool at multiple customers. The systems have been purchased for in-fab process development and automated production monitoring of GaN on Si wafers.
Isaac Mazor, Jordan Valley's CEO, said: "We are pleased to have been selected by key customers to provide in-line metrology for their GaN on Si manufacturing. We believe Jordan Valley is well positioned to support this and other emerging applications, with our comprehensive portfolio of X-ray based technologies and tools. These selections represent the customers' confidence in Jordan Valley's ability to provide innovative and robust solutions for their demanding process development and control needs."
Dr. Paul Ryan, Corporate VP and JV-UK manager noted, "GaN on Si technology presents new metrology challenges and requirements that only High-Resolution X-ray Diffraction (HRXRD) can adequately address. We have been supporting the manufacturing needs of both the compound and silicon semiconductor industries for many years. Bringing together these technologies Jordan Valley can provide solutions for the characterization of these advanced material systems, while meeting the customers' stringent process and automation requirements in a short period of development time. The JVX7300L provides the highest-level of automation, flexibility and robustness for such emerging applications. In choosing the JVX7300L platform, the customers' acknowledged the significant contribution of the product in shortening their process development cycle, together with the ability to use the same tool for production monitoring to help drive yield enhancement."
The JVX7300L is a production worthy X-ray metrology system for GaN on Si and other More-than-Moore applications and can be used for both in-fab process development and production monitoring. The tool supports a wide range of X-ray metrology modes, scanning HRXRD, XRR and (GI)XRD, to provide solutions for a wide range of materials and structures. HRXRD is capable of measuring the composition, thickness strain/relaxation of single and multiple epilayer stacks. Additionally, with XRR and (GI)XRD channels, the tool can also provide information on the thickness and density of a wide range of thin-films as well as providing unique microstructure information (crystallinity, grain-size and phase) of polycrystalline thin-films. Unlike optical or spectroscopic tools, HRXRD and XRR are first principle techniques that deliver accurate and precise results without calibration.
MIGDAL HAEMEK, Israel, July 3, 2014
Jordan Valley Semiconductors Ltd., a leading supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (µXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by another leading memory player. The tool provides fully automated metrology solutions for several key applications, including single µ-bump chemical composition and height measurements, as well as control of multi-layer Under Bump Metallization (UBM) stack deposition.
Isaac Mazor, Jordan Valley's CEO, said: "We are glad to add another leading memory customer to our distinguished list of advanced customers. This is additional proof that Jordan Valley's tool and technology superiority is well appreciated and serves leading companies in the industry. Advancements in WLP technologies, such as the scaling down of solder bumps, complex UBM stacks, etc., set new metrology challenges and requirements that Jordan Valley can address. We believe that our tools will further contribute to our customer's high yield targets in the current and future WLP process."
Jordan Valley's micro-XRF metrology tool is the "tool of record" for single bump composition measurements. It is ideal for non-destructive, in-line µ-bump %Ag measurements and uses a vertical excitation geometry that provides the smallest beam footprint with no dependence on height variation. The tool provides information critical for WLP process control, and comes with fully automated recipe driven measurements and analysis capabilities, advanced navigation algorithms for measurement on product wafers and more.
We are very happy to inform you about the latest development of Mechanical Devices:
New Generation Plungers (NG Plungers)
The New Generation Device plungers were designed for Flex-TC were designed to be strong, reliable with better performance. to be strong, reliable with better performance.
The manufacturer Epoxy Technology Inc. and John P. Kummer Group are pleased to announce the successful completion of ISO 10993 certification of further 3 high-performance adhesives from their product range of biocompatible adhesives, which additionally already hold the USP Class VI classification.
EPO -TEK 377 ® is an optical two - component epoxy resin and as a result of its´ low viscosity and heat resistance, an optimum potting material, that is especially well suitable for optical and medical applications.
A thermosetting system was developed with EPO-TEK ® OD2002. This adhesive is a further advancement of the 353ND-4 and 364. It´s main features are: high Tg (glass transition temperature) of 140 °C, an outstanding strength and excellent moisture/ chemical resistance. The OD2002 is suitable for all conventional sterilization methods such as: ETO, Sterrad, x -ray and autoclaving.
For applications, in which a very quick fixing for manufacturing is required, EPO-TEK OG116 -31 ® is to be recommended. It is an UV-curing 1-component epoxy adhesive that can be thermally post-cured and due to its´ high Tg and low outgassing is particularly suitable at high temperatures.
VLSI Standards, Inc. was founded in 1984 in Mountain View, California for the purpose of developing measurement standards and associated services for the semiconductor and related industries. VLSI Standards' first products were a traceable Step Height Standard, and a line of Contamination Standards. Today, VLSI Standards provides dozens of standards, products, and services to address every aspect of instrument calibration in the semiconductor and other industries requiring accurate metrology.
As of 14/01/01, John P. Kummer GmbH represents VLSI Standards, Inc. beside Germany, Austria and The Netherlands in the following countries:
- Czech Republic
John P. Kummer AG distributes the products from VLSI Standards, Inc. in Switzerland from 14/01/01.
We would like to thank VLSI for the trust in our cooperation and the extension of the distribution territory!