Welcome!

 

 

Forthcoming Events:

 

Technobond

(http://www.technobond.org) from 13.05. to 14.05.13 in Memmingen

 

 

LOPE-C 2013

(http://www.lope-c.com/de/fachmesse/) from 12.06. to 13.06.13 in Munich

Hall B0 booth no. 317

 

  

   

04-2013

 

The Terms and Conditions of Sale for doing business with John P Kummer Limited are now available for download.

 

3d x ray tomographycalibration standards-for-semiconductor manufacturingcure ovenscurve tracer tracingencapsulant removallatex sphere standardsplastic IC decapsulation systemsprobe card metrology analysis cleaningprobe needle cleaningprobe needle refresherprobe process analysisreticle inspection toolsscrub mark analysisSEM sample preparationsemiconductor equipment materialssemiconductor reliability failure analysissurface cleaningTEM sample preparationthin film metrologytransparent substrate inspectionwafer cross sectioningwafer edge inspectionwafer geometry characterisation metrologywafer inspectionwafer map softwarewater fluid flow switch switchesx ray thin film metrology

delamination semiconductor technology Simultaneous thickness and composition measurements Wafer geometry gauge Semiconductor Reliability Failure Analysis Ultraschallmikroskopie Wafer map generation curve tracer semiconductor technology Ultraschallmikroskop Wafer polishing defects Proteus fluid flow switches Automated inspection of flat panel displays Sample preparation for SEM and TEM IC inspection equipment for semiconductors 3D X-Ray inspection materials and services Flexus equipment Wafer inspection equipment Flip Chip Material Suppliers Reticle particle detection Extrusion coating sales Wafer Edge Inspection Coating of large substrates Plastic package decapsulation SEM sample preparation