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JVS Wins More Market Share in Advanced Wafer Level Packaging

MIGDAL HAEMEK, Israel, July 3, 2014

Jordan Valley Semiconductors Ltd., a leading supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that its micro-spot X-ray Fluorescence (µXRF) metrology tool has been qualified for production monitoring of advanced Wafer Level Packaging (WLP) processes, by another leading memory player. The tool provides fully automated metrology solutions for several key applications, including single µ-bump chemical composition and height measurements, as well as control of multi-layer Under Bump Metallization (UBM) stack deposition.

Isaac Mazor, Jordan Valley's CEO, said: "We are glad to add another leading memory customer to our distinguished list of advanced customers. This is additional proof that Jordan Valley's tool and technology superiority is well appreciated and serves leading companies in the industry. Advancements in WLP technologies, such as the scaling down of solder bumps, complex UBM stacks, etc., set new metrology challenges and requirements that Jordan Valley can address. We believe that our tools will further contribute to our customer's high yield targets in the current and future WLP process."

Jordan Valley's micro-XRF metrology tool is the "tool of record" for single bump composition measurements. It is ideal for non-destructive, in-line µ-bump %Ag measurements and uses a vertical excitation geometry that provides the smallest beam footprint with no dependence on height variation. The tool provides information critical for WLP process control, and comes with fully automated recipe driven measurements and analysis capabilities, advanced navigation algorithms for measurement on product wafers and more.