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InfraScan 300 TDE
Laser Probing and Emission Detection in a Single Tool

With the InfraScan 300 TDE you will be able to optically probe your IC devices, checking for process defects and validating your new manufacturing processes. It comes equipped with state of the art emission imaging, along with dual lasers sources. The InfraScan 300 TDE gives its users quick and easy correlation of all optical techniques in a single unit, mounting of the device only once.

Checkpoint’s built-in signal amplifier provides defect localization in IC devices using standard optical techniques. Both constant voltage and constant current modes are available, along with optical probing above and below the silicon energy band gap. Users can also use any self check routine on their IC’s to test for speed path and thermal sensitivity investigations.

Applications:

Process Validation: The InfraScan 300 TDE provides the necessary information for developing new, high-tolerance processes. Using Laser Based Defect Localization techniques, one can pinpoint areas where fab processes need improvement.

Failure Analysis: Now with a system that combines both laser probing and emission detection, your FA lab can pinpoint problems and correlate failures in any device, simply and easily in a single set up.

Design Debug: The InfraScan 300 TDE easily connects to any ATE or application board to debug IC’s. The quick results cut development time and decrease time to market.


InfraScan 300 INV

Debugging Combined with Process Improvement

Debugging your IC designs is now easier, find IC speed bottlenecks and locate heat sensitive regions with the InfraScan 300 INV. Designed

from the ground up for docking with high-speed testers, the combination of the InfraScan 300 INV and IC testing will give you new visibility into your IC designs. The InfraScan 300 INV’s unique communication capability also provides real-time, optical synchronization with all highspeed testers. Or use your IC’s self test capability to isolate all functional issues. Checkpoint’s built-in signal amplifier provides defect localization in IC devices using the latest Laser Based Defect Localization techniques.

Both constant voltage and constant current modes are available, along with optical probing above and below the band gap of Silicon.

Applications:

Process Validation: The InfraScan 300 TDE provides the necessary information for developing new, high-tolerance processes. Using Laser Based Defect Localization techniques, one can pinpoint areas where fab processes need improvement.

Failure Analysis: Now with a system that combines both laser probing and emission detection, your FA lab can pinpoint problems and correlate failures in any device, simply and easily in a single set up.

Design Debug: The InfraScan 300 TDE easily connects to any ATE or application board to debug IC’s. The quick results cut development time and decrease time to market.