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SESAME-1000 Laser Decapsulator

 

The SESAME-1000 Laser Ablation System has been specifically designed for effective decapsulation of IC Packages, containing either a single die or multiple dice.

At the heart of the system is an Nd:YAG 1064 nm diode-pumped laser which is housed inside a chamber to provide full protection against laser radiation and which complies with all international safety standards.

The integrated optical system provides constant sample monitoring. A previously-taken X-Ray or an acoustical microscope image may be superimposed on to the SESAME's live component image to provide additional data for successful decapsulation.

 

 

 

 

 

 

 

 

 

 

 

Advantages of the Laser ablation technique include:

• Complex cavity shapes are easily generated
• No damage to materials such as Al, Cu, Au
• Following laser 'precavitation' a low temperature, low corrosion chemical etch can be used.
• Suitable for ALL encapulant materials
• Ideal for precavitation of power devices

 

The image above shows a BGA Device with all resin and PCB Isolation removed by laser.