SELA is a well-known provider of cutting-edge engineering and failure analysis tools for the semiconductor industry.
MC600i
The MC600i is an enhanced version of the award-winning MC600 Microcleaving System. In addition to all the features of the MC600, the MC600i offers increased accuracy, enables cleaving of smaller wafer segments and dies, and allows cleaving as close as 0.5mm to a sample edge.
The MC600i system achieves fully automatic, reliable and rapid cross-sectioning of wafer segments and dies. Dedicated software enables automatic mapping and navigating to targets, and features automatic off-loading for immediate inspection. These features, together with high throughput (9 min/sample), high accuracy (less than 0.5 micron), and the excellent quality of cross-sections produced, significantly reduce the diagnostic cycle for both failure analysis and process monitoring.
Features
- Fully automated and programmable process
- Single cleave process within 3 minutes
- Small wafer segment capability
- Edge cleaving – as near as 0.5mm to the edge
- Cryo-cooling mechanism (LN2)
- High magnification option/Optical magnification 7600x
Benefits
- Increases overall throughput
- Improves yield analysis
- Improves characterization
- Improves and enhances SEM & FIB utilization
- Low cost of ownership (COO)
EM3
A dedicated, automated, timesaving, and user-friendly system that enables a total solution for TEM/STEM and SEM sample preparation for both cross-section and plan view in a wide range of applications. Featuring a cryo-cooled dry saw process, the EM3 system prepares specimens of either crystalline or amorphous materials. The output sample is mounted onto a compatible stub that allows rework.
Features
- Flexible cryo-cooled dry saw process
- Supports crystalline and amorphous materials
- Plan view and side view preparation
- 300mm stage allowing full wafer inspection and marking (target designation)
- Whole-wafer navigation capability
- High magnification optical microscope
- Active vibration isolated table
Benefits
- Applicable for site-specific and general area features
- Interfaces with broad ion milling
- Increases overall throughput
- Improves yield analysis
- Improves characterization
- Improves and enhances SEM & FIB utilization
- Low cost of ownership (COO)
- Enables multiple reworks of TEM specimen
SELA is introducing the XACT:
The first TEM sample preparation system using the disruptive new AIM technology, delivering significantly reduced turnaround times and enhanced productivity. AIM , SELA's unique Adaptive Ion Milling technology, is superior to the traditional Focused Ion Beam technology (FIB). AIM (TM) can reduce sample widths to below 50 nanometers over a large area with high precision, artifact free (wedge-like) quality, and higher throughput.
SELA's newest system, Xact, introduces a twin-beam combination uniquely configured for more precise end-point detection and artifact-free sample clarity. The Xact joins SELA's SEM-oriented Microcleaving solution to set the standard for high-quality, automated engineering.