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Plant Holidays

We have plant holidays from December 24, 2021 to January 10, 2022. During this time our office is not manned and no dispatch takes place. We will be happy to process your inquiries and orders again from January 10, 2022.

 

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Founder John P. Kummer passed away

We are sorry to announce the passing of our dear friend and the founder of our group of companies, Hans-Peter ‘John’ Kummer.

John was legendary in the semiconductor equipment business and was known and respected around the world. He founded John P Kummer AG in Zug, Switzerland in 1975 and the rest, as they say, is history.

John: Your warmth, wisdom and diplomatic skills will never be replaced.

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TS 3100 Film Thickness Measurement

TohoSpec 3100

Accurate Film Thickness Measurement

The TohoSpec 3100 is a low cost film thickness measurement system that utilizes a modern small spot spectroscopic reflectometer built on a simple-to-use tabletop platform. Incorporating core technology acquired from market leader Nanometrics, this system is specifically designed for a wide variety of R&D applications.

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FLX-3300-R Automated Stress Measurement

FLX Series

Precision Surface Stress Analysis

With thermal cycling and ambient auto-rotation models available, the Toho FLX Thin Film Stress Measurement Systems offer Industry Standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools precisely determine and analyze surface stress caused by deposited thin films.
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FLX 3300-T Thermal Measurement System

FLX Series

Precision Surface Stress Analysis

With thermal cycling and ambient auto-rotation models available, the Toho FLX Thin Film Stress Measurement Systems offer Industry Standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools precisely determine and analyze surface stress caused by deposited thin films.
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FLX2320-R Automated Stress Measurement System

FLX Series

Precision Surface Stress Analysis

With thermal cycling and ambient auto-rotation models available, the Toho FLX Thin Film Stress Measurement Systems offer Industry Standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools precisely determine and analyze surface stress caused by deposited thin films.
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HL9900 Hall Effect Measurement

Toho HL9900

Hall Effect Measurement

HL9900 is a turnkey, high performance hall effect system for the measurement of resistivity, carrier concentration, and mobility in semiconductors. Modular in concept, allowing easy upgrade paths, the system is suitable for a wide variety of materials, including silicon and compound semiconductors. HL9900 has both low and high resistivity measurement capabilities.

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