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SP Series classic barrel reactors for isotropic etching, stripping and cleaning for various industries

Unique Specifications

  • Convenient loading and unloading of product via file cabinet chamber door
  • Optional temperature controlled shelf available
  • Many "special" material handlers and fixtures are stock items
  • Grounded shelf available for caging (down stream) apps
  • All models include 20 processes stored with multi-stepping (parameter change in different places in process)

Features

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BSET EQ Plaser™

With 15 years of plasma decap experience and 5 years of system development, we proudly present the BSET EQ Plaser

Because of new package technologies, it has become more challenging for failure analysis teams to decapsulate today’s semiconductor devices. Often, plasma is the only way to meet your decapsulation needs.

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NT Series Planar Electrode Batch Plasma Systems

NT Series vacuum chambers for plasma etching and cleaning for various industries worldwide

Unique Specifications

  • Ability to perform in direct, R.I.E. and downstream plasma modes without tooling change overs
  • Stainless steel chamber for high process cleanliness and system integrity
  • State of the art process controller geared for process development
  • Proprietary add ons & options
  • Available in stand alone or table top

Features

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QC-TT

The QC-TT is the latest defect metrology system. It helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XRDI) technology. Applications include monitoring buried defects to prevent costly wafer breakage during ultra fast anneal. It can qualify and monitor process tools at any technology node, including 90nm and below, which reduces cycle times and facilitates fab expansion.

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QC-RT

 

The QC-RT is the latest defect metrology system. It uses reflection topography to image the surface and first 10-30µm subsurface region for crystalline defects.

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