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Spin-coating has been the traditional technology used by microelectronic manufacturers in applying multiple-viscosity process fluids to wafers and other substrates.

 

FAS’ patented FAS-Coat™ coating technology offers several advantages over these traditional spin-coating systems. Spin-coating uses a method whereby substrates are spun at extremely high speeds while fluid is poured onto the center, using centrifugal force to cover the substrate. A great deal of fluid (up to 98%) is forced off the surface.

 

FAS’ extrusion products deposit the fluid with precise uniformity over the surface of the substrate with almost no waste of material. High Technology industry is being driven toward more complex products requiring larger area substrates, as evidenced by the mass production of high definition television (HDTV) screens and larger flat panel displays. When coating at these increased resolutions and larger sizes, spinning techniques pose significant technological limitations, including higher susceptibility to damage, which FAS’ pure extrusion coating systems overcome.

 

 

Advantage Series Extrusion Coating System

 

We have solutions for OLED deposition, Organic Solar Cells, and for flexible substrate coating. Contact us for more information