The Candela Product line from KLA-Tencor employs technology originally developed for inspection of disk drive substrates. The innovative optical design allows detection, automatic classification, and review of many difficult - to - detect defect types on opaque AND transparent substrates.
Candela CS10
Optical X-BeamTM Surface Analyzer
The Candela CS10 Optical Surface Analyzer offers a new approach to unpatterned wafer inspection. By combining two laser paths and four independent detection techniques, the CS10 offers exceptional sensitivity to particles and scratches on optoelectronics and semiconductor wafers.
Using a fast spiral scan motion, the CS10 simultaneously measures phase shift, scattered light, reflected light, and topography. The data is represented as high resolution image maps to facilitate visual inspection, or automatically analyzed to detect and classify defects.
The compact CS10 platform is well-suited for both laboratory and low volume production applications. Easy to learn and operate, it's the ideal wafer inspection system for failure analysis and process development applications.
- Offers <0.08 micron particle sensitivity on polished silicon wafers
- Exceptional sensitivity to microscratches for automatic wafer inspection, defect detection and classification on 2" - 12" transparent and opaque wafers.
- Dual-laser X-Beam technology is well-suited for both laboratory and low volume production applications.
Candela CS20
High Brightness LED Automated Wafer Inspection System 
The Candela CS20 is the first automated wafer inspection system designed to address the defect management requirements of the rapidly growing high-brightness light-emitting diode (HB-LED) market. Leveraging a proprietary, multi-channel detection architecture, the CS20 can inspect transparent wafers and epi layers for micro-pits and other defects non-destructively at throughputs of up to 25 wafers per hour--enabling, for the first time, a true production line monitor for wafers used to produce HB-LED devices.
- Single tool solution that combines four techniques in a single scan - scatterometry, reflectometry, phase shift, and optical profilometry--for maximum efficiency in defect detection and classification
- Meets HB-LED industry requirements with sensitivity better than 0.1um particles
- Throughput of up to 25 wafers per hour
- Spatial-signature based algorithms allow for defect classification such as pits, bumps, particles, scratches, stains, slip, and user defined process specific defects.
- Capable of measuring roughness and surface uniformity mapping.