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Yield Engineering Systems (YES) builds process equipment to increase yields and extend device performance. YES manufactures high temperature cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, NEMS and MEMS devices, biosensors and medical slides.
Since 1980, YES has been meeting the needs of innovative process engineers and lab managers. For information or specifications on any YES system, please contact your local Kummer office.
High Temperature Cure Ovens
YES-450PB Series
YES 6-2P-CP (150 mm wafers)
YES 8-2P-CP (200 mm wafers)
YES 12-2P-CP (300 mm wafers)
YES ovens are designed to provide a controlled ramp curing process for temperatures up to 450ºC in an oxygen-free environment. In addition, YES ovens provide a cleaner process in a controlled environment, so you get higher yields. YES ovens offer a unique cooling package to reduce your process time and utilize laminar flow technology, so your wafers stay clean.
Applications:
· Low-K dielectric cure
· Polyimide bake
· BCB cure
· Copper anneal
For an automated high temperature vacuum processing system, please ask about the YES-PBV300.
Chemical Vapor Deposition Systems
YES-1224
YES-1224P (plasma enhanced)
Chemical Vapor Deposition (CVD) is a process used in the semiconductor and biotechnology industries for the deposition of a thin film of various materials in order to achieve surface modification. CVD enables nano-precise surface tension control of your process.
Complete dehydration followed by CVD coating provides a superior silane/substrate bond that is stable after exposure to atmospheric moisture, extending the time available between process steps. Chemical usage for a vapor deposition process is typically less than 1% of the amount needed for wet application processes, significantly reducing waste and chemical costs.
Applications:
· Surface modification to prevent or promote adhesion
· Photoresist adhesion for semiconductor wafers
· Silane/substrate adhesion for microarrays (DNA, gene, protein, antibody, tissue)
· MEMS/NEMS coating to reduce stiction (static friction)
· BioMEMS and biosensor coating to reduce "drift" in device performance
· Promote biocompatibility between natural and synthetic materials
· Copper capping
· Anti-corrosive coating
Vacuum Bake/Vapor Prime Systems
YES-TA Series
YES-3TA, YES-5TA (Vacuum Bake/Vapor Prime)
YES-8TA, YES-10TA (Image Reversal)
YES-310TA, YES-58TA (Dual Function – Vacuum Bake/Vapor Prime Image Reversal)
YES builds vacuum bake/vapor prime, image reversal, and dual function systems. The vacuum bake/vapor prime process achieves strong silane/substrate bonds by combining heat with low pressure. Wafers are completely dehydrated—not only surface moisture, but the chemically bound water molecules as well. Once dehydrated, wafers are primed with HMDS vapor to strengthen photoresist adhesion. Properly treated wafers last for weeks with no change to surface adhesion.
In the image reversal process, the action of positive resist is reversed so negative images can be formed with the same resolution and processing ease of positive resist.
Image reversal advantages:
· Allows variations of the slope of the photoresist sidewall for higher resolution and improved lift off.
· Replaces use of harsh chemicals or plasma "metal etch” processes.
· Using image reversal on two or more layer resist levels can eliminate residual photoresist along the sidewalls, preventing "shorts" from level to level without reducing line width.
· Image reversal done with dark or light fields eliminates standing waves; this allows steep and straight profiles, repeatable results, and excellent chemical deposition uniformity.
· Image reversal achieves excellent results for rework problems; underlying substrate is protected (for a double metal process), so unwanted metal can be stripped away without "pitting" or eroding the underlying level.
Plasma Systems
YES-G Series (Gentle Plasma Cleaning)
YES-G1000
YES-G500
YES-CV200 Series (Powerful Plasma Strip/Descum)
YES-CV200RF
YES-CV200RFS
Plasma cleaning systems are an effective way to gently remove small amounts of contaminants from a substrate surface, while plasma strip systems are used for removing tough layers of polyimide or photoresist. (Plasma strip systems have a “descum” function that can be selected at the switch of a button for gentler cleaning operations).