Wafer cross sectioning
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Wafer cross sectioning - Preparation artifacts are eliminated, SEM sample and TEM sample preparation times are greatly reduced, section placement accuracy enhanced. Lower operator skill prerequisites are required. Furthermore, the substrate dictates the overall wafer cross sectioning quality and does so without compromising the quality of the process layers. Over 190 SELA Microcleaving Systems are currently in operation worldwide. Customers include major semiconductor manufacturers like Motorola, HP, TI, ST, National, Intel, Samsung and TSMC.

How Microcleaving WorksMicrocleaving is a dry procedure that capitalizes on the cleaving characteristics inherent in single crystal substrates and achieves sub-micron sectioning accuracy through the targeted feature. The precision and quality of the cross-section is achieved by having the fracture plane coincide with the natural crystal plane of the material. The cleave, achieved without any loss of material, preserves the integrity of the designated area. Microcleaving offers the semiconductor industry cost and time saving in process control, failure analysis and R&D defect analysis turn-around time. Preparation artifacts are eliminated, SEM sample and TEM sample preparation times are greatly reduced, section placement accuracy enhanced. Lower operator skill prerequisites are required. SELA, founded in 1992, currently develops, manufactures and markets automated SEM and Probe needle cleaningequipment primarily for the semiconductor industry. SELA’s proprietary Microcleaving technology enables fast, dry, clean and artifact-free sample preparation from wafers with a feature location accuracy of less than 0.5 microns.Over 190 SELA Microcleaving Systems are currently in operation worldwide. Customers include major semiconductor manufacturers like Motorola, HP, TI, ST, National, Intel, Samsung and TSMC. With a repeat order rate of over 50% and the prestigious Editors’ Choice Best Product Award of 1998 of Semiconductor International to its credit, SELA has set an industrial standard. SELA, a privately held company based in Israel with a wholly owned subsidiary, SELA USA, located in Sunnyvale, CA., maintains a global network of offices and distributors to provide support and service to its customers. Distributors are located in Korea, Japan, Singapore, Taiwan, China and all of Europe.The Semiconductor Business Unit at Applied Precision produces technology for the semiconductor test floor. Our products enable improved probe card development and repair, increased semiconductor yields, and reduced cost of operations. Anchored by our PrecisionPoint line of probe card analyzers, Applied Precision is continuing our tradition of technology and market leadership in both probe card analysis and semiconductor test floor process. 1975 John P Kummer AG was founded in Switzerland as a specialist distributor of instruments used in the manufacturing of Semiconductors. Our first product in this field was the Alpha-Step profiler made by Tencor Corporation

1978 John P Kummer GmbH founded in Munich, Germany. 1984 John P Kummer Sarl founded in Rungis, France. 1989 John P Kummer Ltd founded in Lancaster, UK 1993 John P Kummer GmbH relocated to Augsburg, Germany 1999 John P Kummer Ltd relocated to Marlborough UK2000 Celebrating 25 years of the John P Kummer Group