Wafer inspection
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Wafer inspection We rely for success on a relatively small number of suppliers and customers. Our relationships are the vital core of our business so we are obliged to maintain the highest standards in all our business practices. Recent changes in regulatory matters have led to us becoming increasingly involved in certification processes and we now routinely work with our suppliers to assist in such processes.

Wafer inspection - Using our long established relationships within the worldwide Industry we bring the newest and most technologically advanced products to the European Microelectronics Community. Sometimes we work with small startups; in other cases we work with suppliers who have been in existence as long as we have. In any case we have a simple and clear objective – to match the capabilities of these products with the needs of our customer base.

Microcleaving offers the semiconductor industry cost and time saving in process control, failure analysis and R&D defect analysis turn-around time. Preparation artifacts are eliminated, SEM sample and Wafer inspection times are greatly reduced, section placement accuracy enhanced. Lower operator skill prerequisites are required. We have a small team of very experienced administrators who handle all sales and marketing activities. We invest heavily in our business systems and technology to maintain the highest level of reliability in our record keeping and communications.

SELA, founded in 1992, currently develops, manufactures and markets automated SEM and Wafer inspection equipment primarily for the semiconductor industry. SELA’s proprietary Microcleaving technology enables fast, dry, clean and artifact-free sample preparation from wafers with a feature location accuracy of less than 0.5 microns.Over 190 SELA Microcleaving Systems are currently in operation worldwide. Customers include major semiconductor manufacturers like Motorola, HP, TI, ST, National, Intel, Samsung and TSMC. With a repeat order rate of over 50% and the prestigious Editors’ Choice Best Product Award of 1998 of Semiconductor International to its credit, SELA has set an industrial standard. Microcleaving is a dry procedure that capitalizes on the cleaving characteristics inherent in single crystal substrates and achieves sub-micron sectioning accuracy through the targeted feature. The precision and quality of the cross-section is achieved by having the fracture plane coincide with the natural crystal plane of the material. The cleave, achieved without any loss of material, preserves the integrity of the designated area. Furthermore, the substrate dictates the overall cross-section quality and does so without compromising the quality of the process layers.

SELA, a privately held company based in Israel with a wholly owned subsidiary, SELA USA, located in Sunnyvale, CA., maintains a global network of offices and distributors to provide support and service to its customers. Distributors are located in Korea, Japan, Singapore, Taiwan, China and all of Europe.

Please contact us by e-mail, telephone or by Fax for more details of the products and services described in this web site.