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The ASAP-1 is a well known tool for the preparation of samples for backside imaging and for other routine failure analysis preparation.

Product Highlights

  • Suits all sizes of die
  • Low damage patented floating-head polishing method allows for extremely thin samples
  • Mechanical Decapsulation (on S-CSP, BGA, flip chip, power device, MCM package styles and most other styles)
  • Accurately decaps, then thins substrate and polishes
  • Intuitive and easy to use
  • Enables layer by layer topside removal 
  • Short set-up and process times
  • Easy die-tilt adjustment, 'on the fly'


Please contact us for more details of the Ultratec product range and feel free to use the excellent Ultratec website.