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The Onyx dedicated for BEOL applications is a novel fully automated in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry.
The unique hybrid configuration of the ONYX enables providing a solution to challenging applications through various analytical approaches and effective SW algorithms:
- Metal film stacks thickness measurements
- Feature dimensions measuring
- Detection and analysis of voids or missing layers
- XRF thickness standards verification
- Detecting specific miss-processing out of a multi-variable metrology application
- Algorithm compensation for parameter variations of a film stack
The ONYX integrates enhanced ED-XRF micro-spot analysis, 3D scanning and 2D microscope technologies, and a unique integrative software to operate in one fully automated system, serving in-line and non-destructive applications. The result of this unique integration is a synergic effect that enables dealing with complex applications in the following manner: Geometrical parameters can be easily monitored with high throughput and precision of the optical components and include features such as: width, length, height, shape and surface. By measuring with the enhanced ED-XRF component, material and volumetric parameters can be obtained, such as film thickness and composition.
The ONYX’s unique triple-mode technologies and capabilities, is designed to meet both fast in-line and in-depth metrology challenges, without interrupting the process flow. Enabling several physical parameters to be measured across the wafer, wafer to wafer, and lot to lot - ensures the process is controlled. The ONYX is dedicated and designed to serve multiple in-line and non-destructive metrology and inspection needs in the semiconductor and related micro-electronics industries.
For more information visit: http://www.xwinsys.com/onyx