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The ASAP-1 is a well known tool for the preparation of samples for backside imaging and for other routine failure analysis preparation.
- Suits all sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation (on S-CSP, BGA, flip chip, power device, MCM package styles and most other styles)
- Accurately decaps, then thins substrate and polishes
- Intuitive and easy to use
- Enables layer by layer topside removal
- Short set-up and process times
- Easy die-tilt adjustment, 'on the fly'
Please contact us for more details of the Ultratec product range and feel free to use the excellent Ultratec website.