You are here
EPO-TEK® electrically conductive epoxies have been used successfully for over 50 years in a wide variety of applications including:
- IC packaging,
- Underfilling of FC’s and BGA’s
- Hybrid microelectronics
- Circuit assembly
- Solar cell assembly
- High temperature/high power management
These products are solvent-free, and depending upon type may be cured at room temperature as well as at elevated temperatures.
Optimal surfaces to bond with an electrically conductive product are typically gold, palladium, silver palladium, copper, some different alloys as well as ITO.
Please contact us for further information.