UniTemp

UniTemp GmbH was founded in August 2000.
They are specialized in all kinds of thermal process equipment. Their success is based on more than 20 years experience in developing and producing R&D equipment for labs and small series production. Their key features are rapid thermal annealing systems, reflow solder ovens (fluxless and void free soldering) and high precision hot plates. They also offer a VSS Vacuum Solder System where flux can be used.

They combine high tech equipment with best quality, perfect ergonomic handling and best design. Their focus is the special demand and customer's application. They are very flexible in adapting our standard equipment according to special requirements. Their object in view is best support before and after sales.

Applications and processes:

• MEMS package sealing with getter activation
• Rapid Thermal Annealing/Processing
• Solder Bump Reflow with Plasma pre-cleaning
• Reflow Soldering, voidfree, fluxless and leadfree
• Baking and curing of photoresists
• Sensitive BCB Curing
• AuGe/SiAu alloying
• Flip-Chip soldering
• Package lead sealing
• Laser/RF/power die attachmentRapid Thermal Processing of Solar Cells by Silicon Wafer Bonding on low cost substratesProcessing of high efficiency silicon solar cells by bonding to borosilicate glass

Find more information here.