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Topography and Deformation Measurement (TDM)

TDM is a patented Insidix technology that helps the engineers to increase reliability
of their products from complex packaging and allows Failure Analysis engineers to
understand the root causes of failure observed in operations. The TDM operating
system combines a powerful, internally developed heating/cooling sequence with a
sophisticated optical set up for 3D topography analysis under thermal stress of all
kinds of materials, components & sub-systems. TDM can impose the same thermal

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INSIDIX

Insidix is a Grenoble based company created in 1996 by Jean-Claude Lecomte, an experienced engineer and innovator, highly regarded as a pioneering expert in high definition non-destructive control systems for the microelectronics industry.

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MaxTC Hochleistungs-Temperatur-System

Thermisches Stressen von DUTs von -60°C bis zu +300°C
Hochleistungs Chips >100W -  Sehr hohe Heiz/Kühl-Raten -  Tieftemperatur-Testen
 
Mechanical Devices, ein israelischer Hersteller von Hochleistungs-Thermosystemen, stellt ihr neues Produkt vor: MaxTC - ein innovatives Temperatur-System für Device-, Board-, und Modul-Tests ohne großen Aufwand in allen Umgebungen – im Entwicklungslabor, im Produktions-Tester-Floor, im Test-Labor.
 

Die Geräte von Mecha

Deutsch

Epoxy Technology, Inc.® und die John P. Kummer Gruppe gründen ein neues Unternehmen für das Konfektionieren von EPO-TEK® Klebstoffen - Epoxy Technology Europe Ltd.

Seit 2010 konfektioniert die John P. Kummer Ltd vorgemischte und tiefgefrorene EPO-TEK® Klebstoffe in Kartuschen für den europäischen Markt. Die Fertigung ist ISO9001:2008 zertifiziert. Das neue Unternehmen, Epoxy Technology Europe Ltd, ist ein Joint Venture zwischen Epoxy Technology Inc als Hauptanteilseigner und der John P. Kummer Gruppe. Dieser Schritt unterstreicht die Bedeutung des europäischen Marktes und bildet die Basis für eine langfristige und erfolgreiche Zusammenarbeit zwischen Kunde und allen beteiligten Unternehmen.

Deutsch

Elite Etch Cu ESD 7200

ESD Dual Acid Decapsulation System

ESD Dual Acid Decapsulation for Copper ICs

Elite Etch - Cu ESD is an Automated Mixed Acid Decapsulator, with advanced feature integration to enable high productivity. This Decapsulator easily and rapidly opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to the package with no sample damage.

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MountPlate Model 5800

Heated sample mounting system

The RKD Engineering Model 5800 MountPlate is a specially designed hot plate used for wax mounting of integrated circuit packages in preparation for back side thinning and polishing. The unit heats the sample holding fixture at a controlled rate thereby preventing thermal damage to the sample during mounted. When the programmed temperature is reached, the operator is prompted to mount and align the sample. After alignment and mounting the unit cools the sample and holding fixture at a controlled rate to harden the mounting wax.

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7100 Elite Etch Cu

Acid Decapsulation for Copper

The first acid decapsulator made for copper

The Elite Etch-Cu from RKD engineering is an Automated Mixed Acid Decapsulator, with advanced feature integration to enable high productivity. The Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to package with no sample damage.

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Elite Etch Model 7000

Dual acid decapsulation system

The Elite Etch from RKD Engineering is an Automated Mixed Acid Decapsulator that enables high productivity through the integration of advanced features. This Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or mixes of these acids to the package with no sample damage. The delivery of  is done with enough pressure to create extreme turbulence in the etched cavity greatly accelerating the rate of encapsulant removal.

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