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Flat Lapping and Polishing Machine

ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance’s unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC’s.

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MULTIPOL 8 and 10 from ULTRA TEC are versatile lapping and polishing systems capable of preparing the most demanding specimens required by Research and Industry. Primarily designed for failure analysis, research and pilot-scale production applications, they allow for many methods of sample holding-producing a high versatility which is further extended by the availability of a wide range of accessories and polishing plates. Optical Standards of finish may be achieved with the use of a reciprocating sweep mechanism.

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Manual Lapping & Polishing Machine

ULTRAPOL Basic lapping and polishing machine offers the build-quality required for high precision manual polishing.

The system has an 8 inch, replaceable polishing plate, faucet coolant, and dual lap direction.

Product Highlights

  • Cost-effective manual polisher
  • Can be used with manual tools
  • High Quality Build - long lasting


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Entry-level Slicing Machine

ULTRATRIM is a low cost, entry-level, precision sawing machine for producing rapid cross-sections for microscopy and QC checks.

The saw includes a straightforward coolant reservoir, the saw blade dips into the reservoir for effective cooling and lubrication of the sawing process. An intelligently designed manually fed cutting table, makes slicing fast and easy. The saw has a fully variable spindle speed and a small footprint.

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Blue Mill

Device Pre-Cavitation & Gasket Milling Machine

Every lab can now produce accurate, reproducible pre-cavitated devices -- ready for final decapsulation with RAPIDETCH, other chemical decapsulators, or PLASER plasma decapsulation system

Flip-chip and power chip mechanical pre-decapsulation is now straightforward and accurate.

BLUE MILL brings cost-effective, bench-top decapsulation and elastomer gasket milling to the electronics community. 

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ICis Microscope

Materials Inspection System

ICis is a modular microscope offering up to 3 standard modes, often required by professionals in the electronics and related industries. The system is designed to be a primary tool for the engineer or technician working at a nearby polishing station. ICis allows for fast substrate thickness measurements of backside thinned and polished samples; it is also invaluable for fast imaging and archiving of die samples being parallel polished / de-processed. 

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Versatile Precision Saw for small workspaces & small budgets

For the user who wants all the functionality and unique control of cutting parameters offered by a high end saw, while working on a tight budget or with limited lab space, ULTRASLICE Compact  provides the answer.

The system features an integral coolant recirculation system which extends blade life and clears cutting debris to improve cutting rate and surface quality.

Work is fed into the blade by several different methods, by use of table attachments.

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Versatile Precision Saw with Z-spindle

Developed to facilitate precision sectioning applications in Industry and Research, ULTRASLICE Precision Saw provides the user with a unique combination of features:


The system may be readily converted to handle sample cutting requirements of most shapes, sizes, and applications.


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Every lab can now produce accurate, reproducible pre-cavitated, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decapsulation is now straightforward and accurate. ASAP-1®  DECAP brings cost-effective, bench-top advanced decapsulation and selected area polishing to the electronics community. 

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