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Innovation in Failure Analysis and Material Diagnostics of Electronics Components
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News
Wir freuen uns, unsere neue Partnerschaft mit infinityPV bekannt zu geben – einem Unternehmen, das für seine wegweisenden Technologien im Bereich der Schlitzdüsenbeschichtung und der Rolle-zu-Rolle-Verarbeitung bekannt ist. Diese strategische Zusammenarbeit markiert für uns einen wichtigen Meilenstein, um gemeinsam innovative Produkte für die Halbleiterindustrie, New Energy (Perovskite, Brennstoffzellen etc) und Life Sciene zu entwickeln und neue Marktpotenziale zu erschließen.
Die Zusammenarbeit ist auf Europa ausgerichtet und mit Schwerpunkt auf die D-A-CH-Region (Deutschland, Österreich, Schweiz). Hier bündeln wir unsere langjährige Expertise in der Halbleitertechnik, PV, Mikroelektronik sowie Life Science mit der technologischen Innovationskraft von infinityPV schaffen wir die Basis für zukunftsweisende Lösungen, die Nachhaltigkeit, Effizienz und Qualität vereinen. Im Zentrum der Kooperation stehen die Entwicklung und Markteinführung neuartiger Materialien und Prozesse, die das Anwendungsspektrum in der Beschichtungstechnologie erweitern und optimieren sollen.
Wir freuen uns auf die enge Zusammenarbeit mit dem Team von infinityPV und auf die spannenden Projekte, die vor uns liegen.
Ultran offers industry-leading transducer and systems products. A pioneer of low frequency, non-contact, dry coupled, and very short pulse conventional transducers. In addition to fully turn-key bench-top R&D ultrasonic analysis systems, The Ultran Group now provides production line quality analysis systems for continuously moving weblines, piece-part manufacturing, and large structure aircraft and spacecraft components. Quality products since 48 years!
We are deligthed at JPK Group to announce our new partnership with SEMICAPS.
SEMICAPS designs, manufactures and markets innovative fault localization microscopes which are used by the top semiconductor companies. Customers use these equipment for their design-debug and yield analysis work. These world leading instruments help users to, efficiently and quickly, ramp up the yield of their latest chip designs by analyzing and locating faults in their engineering samples and early production runs.
We are deligthed at JPK Group to announce our new partnership with SOLARIUS. SOLARIUS is a leading provider of precision systems for non-contact surface inspection, measurement, analysis, and visualization. The product portfolio combines high-resolution sensors with automated data acquisition systems and powerful analysis tools. Offerings range from desktop systems for off-line inspection, to semi-automated systems for fast, precise measurements, to customized multi-station platforms for high-volume in-line inspection.Based on experience in various fields, we use this technology for Optical Probe Card Inspection. If you are either looking for cyclic routine inspection, new card income inspection or post maintenance check-up, SOLARIUS will be able to support your application request. Our target: A fast probe card inspection enabling a clear and resilient decision if a probe card is OK for testing or NOT.www.solarius-europe.com 
At ISTFA, Rosine GERMANICUS presented a paper about "SiC MOSFET micro-explosion due to a Single Event Burnout: analysis at the device and die levels". We at JPK Group are proud that we could support this paper with sample preparations conducted with a micro milling tool from our principle ULTRA TEC.
Please contact us for the complete paper or interest in Failure Analysis, Sample Preparation or FA Workshop on January 31, 2024 in Munich.
Contact: sales_de@jpkummer.eu
For device qualification in harsh environments (space, avionic and nuclear), radiation testing identifies the sensitivity of the devices and technologies and allows to predict their degradation in these environments. In this paper, the analysis of the electrical characteristics and of the failure of a commercial SiC MOSFET after a Single Event Burnout (SEB) induced by proton irradiation are presented. The goal is to highlight the SEB degradation mechanism at the device and die levels. For failed devices, the current as a function of the drain-source bias (VDS) in off-state (VGS=0V) confirms the gate rupture. For the die analysis, Scanning Electron Microscopy (SEM) investigations with energy-dispersive X-ray spectroscopy (EDX) analysis reveals the trace of the micro explosion related to the catastrophic SEB inside the SiC die. With a fire examination, similar to a blast, the SEM analysis discloses damages due to the large local increase of the temperature during the SEB thermal runaway, leading to the thermal decomposition of a part of the SiC MOSFET and the combustion with gaseous emissions in the device structure.
The JP Kummer Group is glad to introduce our new partner eInnoSys
eInnosys is a leading provider of automation and software solutions for the manufacturing industry. With a focus on Factory & Assembly Automation, Equipment Software, Industry 4.0, AI/ML, and predictive maintenance, the company has developed innovative and patented products in these areas. As a leader in the field of smart manufacturing and industrial automation, eInnosys specializes in upgrading legacy equipment and implementing predictive maintenance solutions to drive efficiency and productivity. The company’s expertise in AI/ML enables them to analyze data and provide predictive insights, helping their clients to stay ahead of the competition.
