VSS-300

Vacuum Reflow Solder Oven for up to 300 x 300 mm substrate size and temperature up to 450 °C

Application:

Perfect for solder processes with substrate size up to 300 mm x 300 mm.
Due to the gas sealed separation of the working capacity (chamber) from the lamp fields this is a perfect tool for contaminating processes. The chamber parts can be easily cleaned.
Through the chamber walls there can be led different feed throughs, like window for optical measurement tools, thermocouple feed through, gas inlets, etc.
The process cycles are very short due to fast reaching of vacuum with 10exp.-3 hPa.

Here are the most feasible applications and processes:

• Solder Reflow with and without flux
• Wafer bump and solder ball reflow
• Flip Chip
• Encapsulation and sealing of housings
• High Power LED module
• resistor paste firing
• IGBT/DBC
• Die attachment

Chamber:

• Chamber size: 350 x 350 x 75 mm (optional up to 120 mm with round viewing window 65 mm dia.)
• optional: extended opening height: 200 mm to 300 mm 
• Chamber walls: Aluminium polished, easy to clean (optional: stainless steel)

Loading:

• Cover: opens and closed vertically  (top loader)
• Direct or remote control  for automatically application (SPS, robotics,etc).

Ramp up rate:        up to 150K/min.
Ramp down rate:   up to 120K/min.

Heating:

• Bottom heating: 2 x 12 lamps crossed 18 kW
• Top heating: on request

 Cooling:

• Chamber: by a water cooled graphite plate 310 x 310 mm

Process control:

• Control: SIMATIC SPS with touch panel 7"
• Software: process control, programming, recording and process
  documentation.
• 50 programs with 50 steps each storable

Process gases:

• 1 Mass Flow controller for 5 nlm (norm liter per minute) is standard
• Optional: up to 4 gas lines

Vacuum (optional):

• MPC (Chemical resistant Membrane pump): 10  hPa. Monitored by manometer.
• RVP (Rotary vane pump):  10exp.-3 hPa. Vacuum sensor up to 10exp.-3 mbar