SAM VUE400-P
The SCANNING ACOUSTIC MICROSCOPY VUE400-P is for Semiconductor Device Integrity Assessment and Failure Analysis and incorporates the latest in transducer and signal processing.
The SCANNING ACOUSTIC MICROSCOPY VUE400-P is for Semiconductor Device Integrity Assessment and Failure Analysis and incorporates the latest in transducer and signal processing.
The first TEM sample preparation system using the disruptive new AIM technology, delivering significantly reduced turnaround times and enhanced productivity. AIM , SELA's unique Adaptive Ion Milling technology, is superior to the traditional Focused Ion Beam technology (FIB). AIM (TM) can reduce sample widths to below 50 nanometers over a large area with high precision, artifact free (wedge-like) quality, and higher throughput.
A dedicated, automated, timesaving, and user-friendly system that enables a total solution for TEM/STEM and SEM sample preparation for both cross-section and plan view in a wide range of applications. Featuring a cryo-cooled dry saw process, the EM3 system prepares specimens of either crystalline or amorphous materials. The output sample is mounted onto a compatible stub that allows rework.
Features
The MC600i is an enhanced version of the award-winning MC600 Microcleaving System. In addition to all the features of the MC600, the MC600i offers increased accuracy, enables cleaving of smaller wafer segments and dies, and allows cleaving as close as 0.5mm to a sample edge.
As part of the Toho Group of companies, Toho Technology Inc. builds on a 200-year legacy of pioneering meaningful businesses that meet quality production needs around the globe. They deliver precision industrial and life-science technologies that enhance business and lives.
Our capacitive based system can be used in many different applications. Generally, the systems measure distance, displacements and thickness of various materials.
Because of the use of a relatively low carrier frequency, in the case of silicon, there is no influence of the material's resistivity. The systems can be used in the entire range between 0,001 ohm-cm and 1.000 ohm-cm without calibration.
The semiconductor industry is now our biggest customer. Our different gauges can measure the Thickness, TTV, Bow, Warp and Stress.
T.I.P.S. mission statement which emphasize on technical innovation, applied physics and electronics gives our customer confidence beeing state of art in measurement technology.
Yield Engineering Systems, Inc. is known worldwide for supplying quality process equipment to Semiconductor and related industries, including MEMS, Medical, BioSensor, Microarray, Nanotech, Hard Disk Drive, and more.