Materials Inspection System

ICis is a modular microscope offering up to 3 standard modes, often required by professionals in the electronics and related industries. The system is designed to be a primary tool for the engineer or technician working at a nearby polishing station. ICis allows for fast substrate thickness measurements of backside thinned and polished samples; it is also invaluable for fast imaging and archiving of die samples being parallel polished / de-processed. 

Versatile Precision Saw for small workspaces & small budgets

Versatile Precision Saw with Z-spindle

Developed to facilitate precision sectioning applications in Industry and Research, ULTRASLICE Precision Saw provides the user with a unique combination of features:

VERSATILE SAMPLE HOLDING 

The system may be readily converted to handle sample cutting requirements of most shapes, sizes, and applications.

CUTTING ACCURACY & CONSISTENCY

Digital Selected Area Preparation System

ARC-lite is the world's first system to offer fast, reliable, room temperature AR coatings on package and wafer level devices. ARC-lite is used as a free-standing unit for AR coating polished backside surfaces. The sample produced are optimized and require no baking.

ARC-lite reaches maximum functionality when used with the ASAP-1 Selected Area Preparation System -- The ARC-lite sample mounting plate can be conveniently transferred between ARC-lite and ASAP-1.

Waferstudio is a visualization and data analysis software package that easily generates 3D views of wafers (wafer maps) and their related data nad provides powerful tools to work with this data.

The MX604 is an unique wafer characterisation system for solar- and semiconductor wafer.
The combination of capacitive and inductive sensors allow to measure tickness and resistivity at the same spot. The system is completely self calibrating, hence temperature and humidity variations are negligible. 

The MX2012 is an automatic wafer geometry gauge to measure stress on 300 mm Si-wafers during Production. E+H’s technology using congtactless capacitive sensors is applied.
Throughput is 60 wafers/ hour

The MX2118 is a fully automated wafer geometry gauge.
A combination of two gauges offers the measurement of thickness, flatness, bow and warp

for 450 and 300 mm Si-Wafer

The MX203 is a manual loaded wafer geomtery gauge.
It measures the thickness, bow and warp of silicon wafer.
Stress option is available as well.