The X-SAM M-51 is a new scanning acoustic microscope designed for quality control and day-to-day use.

The precision SAM is based on an intuitive software interface to easily perform inspection tasks for microelectronics, power electronics, semiconductor components, and many more.

The Viscom X-ray system X8011-III is designed as a team player for individual and reliable use for 2D and 3D X-ray inspection. Thanks to its innovative and simple system operation, the system can be used for manual and automatic X-ray inspection of components, assemblies during production, quality assurance and development – thereby making a sustainable and result-oriented contribution to cost optimization, process reliability and increased product quality.

iX7059 One – The ONE ideal inspection system for your advanced assembly, power module and semiconductor production.

In the pursuit of excellence, precision is non-negotiable. With the iX7059 One, precision is not just a goal; it is a guarantee. Equipped with state-of-the-art imaging capabilities, this system delivers unrivaled image quality down to an astonishing 1μm resolution.

iS6059 Wire Bond Inspection – High-Performance Automatic 2D & 3D Wire Bond Inspection

With the iS6059 Wire Bond Inspection system, Viscom offers the best inline technology and top performance for the automatic optical inspection of wire bonds. Where high throughput is a must, dual-track operations can significantly cut inspection times. The system is particularly easy to configure beyond standard specifications to meet customer-specific needs.

Unique Atomic Force Microscope LiteScope is designed to merge the strengths of AFM and SEM techniques, resulting in effective workflow and extending the possibilities of corr