These high-performance coaters are used in large volume production of LCD products, PV, OLED, Flexible Display and various Organic and Printed Electronics applications. This system offers a robust, production-ready platform that generates high yields (>95%) with minimal operating and maintenance costs. It is available for processing Gen2 through Gen8 substrate sizes and beyond. It is also available for Spinless Coating of up to 450mm Silicon wafers.

The first TEM sample preparation system using the disruptive new AIM technology, delivering significantly reduced turnaround times and enhanced productivity. AIM , SELA's unique Adaptive Ion Milling technology, is superior to the traditional Focused Ion Beam technology (FIB). AIM (TM) can reduce sample widths to below 50 nanometers over a large area with high precision, artifact free (wedge-like) quality, and higher throughput.

A dedicated, automated, timesaving, and user-friendly system that enables a total solution for TEM/STEM and SEM sample preparation for both cross-section and plan view in a wide range of applications. Featuring a cryo-cooled dry saw process, the EM3 system prepares specimens of either crystalline or amorphous materials. The output sample is mounted onto a compatible stub that allows rework.

Features

The MC600i is an enhanced version of the award-winning MC600 Microcleaving System. In addition to all the features of the MC600, the MC600i offers increased accuracy, enables cleaving of smaller wafer segments and dies, and allows cleaving as close as 0.5mm to a sample edge.

FLX Series

Precision Surface Stress Analysis

Our capacitive based system can be used in many different applications. Generally, the systems measure distance, displacements and thickness of various materials.
Because of the use of a relatively low carrier frequency, in the case of silicon, there is no influence of the material's resistivity. The systems can be used in the entire range between 0,001 ohm-cm and 1.000 ohm-cm without calibration.

The semiconductor industry is now our biggest customer. Our different gauges can measure the Thickness, TTV, Bow, Warp and Stress.

• suitable for cantilever probecards: probe pitch from 50 µm, tip diameter from 10 microns, probe materials: W, WRe, CuBe, Paliney
• cleaning/reshaping for vertical probe cards optional
• reshaping method based on specifically formulated abrasive elastomer pad
• highly polished probe surfaces after reshaping (surface roughness < 0.3 microns)
• very good contact resistance after reshaping
• maintains probecard alignment integrity, no realignment due to reshaping process necessary
• fully automatic, no specific operator skills required
• short p