The first TEM sample preparation system using the disruptive new AIM technology, delivering significantly reduced turnaround times and enhanced productivity. AIM , SELA's unique Adaptive Ion Milling technology, is superior to the traditional Focused Ion Beam technology (FIB). AIM (TM) can reduce sample widths to below 50 nanometers over a large area with high precision, artifact free (wedge-like) quality, and higher throughput.
A dedicated, automated, timesaving, and user-friendly system that enables a total solution for TEM/STEM and SEM sample preparation for both cross-section and plan view in a wide range of applications. Featuring a cryo-cooled dry saw process, the EM3 system prepares specimens of either crystalline or amorphous materials. The output sample is mounted onto a compatible stub that allows rework.
Features
The MC600i is an enhanced version of the award-winning MC600 Microcleaving System. In addition to all the features of the MC600, the MC600i offers increased accuracy, enables cleaving of smaller wafer segments and dies, and allows cleaving as close as 0.5mm to a sample edge.
Our capacitive based system can be used in many different applications. Generally, the systems measure distance, displacements and thickness of various materials.
Because of the use of a relatively low carrier frequency, in the case of silicon, there is no influence of the material's resistivity. The systems can be used in the entire range between 0,001 ohm-cm and 1.000 ohm-cm without calibration.
The semiconductor industry is now our biggest customer. Our different gauges can measure the Thickness, TTV, Bow, Warp and Stress.
T.I.P.S. mission statement which emphasize on technical innovation, applied physics and electronics gives our customer confidence beeing state of art in measurement technology.
Yield Engineering Systems, Inc. is known worldwide for supplying quality process equipment to Semiconductor and related industries, including MEMS, Medical, BioSensor, Microarray, Nanotech, Hard Disk Drive, and more.
VLSI Standards, Inc. was founded in 1984 in Mountain View, California for the purpose of developing measurement standards and associated services for the semiconductor and metrology related industries. VLSI Standards' first products were a NIST traceable Step Height Standard, and a line of Contamination Standards. Today, in our class I fabrication facility, along with offices in the US and Japan, VLSI Standards provides dozens of standards, products, and services to address every aspect of instrument calibration in the semiconductor and other industries requiring precise metrology.
ULTRA TEC designs, manufactures and provides advanced surface & sample preparation equipment and consumables for both routine and custom applications in a multitude of industrial settings. They offer solutions for development, analytical and research environments, right up to production.
SELA develops and adapts technologies to provide roadmap solutions for physical failure analysis and characterization.
SELA offers a modular suite of tools for cost-effective material and root-cause failure analysis as from 1991.
SELA’s products incorporate unique technologies and IPs that solve bottlenecks in the failure analysis and sample preparation for wide variety of requirements.