- 76.2 mm, 200 mm, or 300 mm silicon wafers
- Used with 4-Point Probes, Eddy Current Gauges
ITO Sheet Resistance Standards
- 125mm x 125mm x 0.7mm
- 90% In2O3:10% SnO2 plates
The NanoLattice Module Standard (NLSM) is a CD SEM calibration standard which enables accurate sub 0.13 μm lithography. The NanoLattice has the 0.1 μm pitch required for sub 0.13 μm SEM magnification calibration and characterization of non-linearity across the field of view.
A Key Feature of our ASAP-1 IPS System has been the ALWAYS LIVE MACHINE VISION screen which enables the user to make REALTIME processing decisions. This feature is becoming more and more crucial with the move to ever thinner silicon, and the complexities of modern mechanical decapsulation.
MIGDAL HAEMEK, Israel, July 7, 2014
Jordan Valley Semiconductors Ltd., a leading supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that it has recently delivered and successfully commissioned its JVX7300L in-line X-ray metrology tool at multiple customers. The systems have been purchased for in-fab process development and automated production monitoring of GaN on Si wafers.
MIGDAL HAEMEK, Israel, July 3, 2014
We are very happy to inform you about the latest development of Mechanical Devices:
New Generation Plungers (NG Plungers)
The New Generation Device plungers were designed for Flex-TC were designed to be strong, reliable with better performance. to be strong, reliable with better performance.
We are glad to welcome INSIDIX in our supplier portfolio and look forward to a successful business cooperation!
TDM is a patented Insidix technology that helps the engineers to increase reliability
of their products from complex packaging and allows Failure Analysis engineers to
understand the root causes of failure observed in operations. The TDM operating
system combines a powerful, internally developed heating/cooling sequence with a
sophisticated optical set up for 3D topography analysis under thermal stress of all
kinds of materials, components & sub-systems. TDM can impose the same thermal