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EM3

A dedicated, automated, timesaving, and user-friendly system that enables a total solution for TEM/STEM and SEM sample preparation for both cross-section and plan view in a wide range of applications. Featuring a cryo-cooled dry saw process, the EM3 system prepares specimens of either crystalline or amorphous materials. The output sample is mounted onto a compatible stub that allows rework.

Features

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MC600i

The MC600i is an enhanced version of the award-winning MC600 Microcleaving System. In addition to all the features of the MC600, the MC600i offers increased accuracy, enables cleaving of smaller wafer segments and dies, and allows cleaving as close as 0.5mm to a sample edge.

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Toho Technology

As part of the Toho Group of companies, Toho Technology Inc. builds on a 200-year legacy of pioneering meaningful businesses that meet quality production needs around the globe. They deliver precision industrial and life-science technologies that enhance business and lives.

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FLX2320-S Stress Measurement System

FLX Series

Precision Surface Stress Analysis

With thermal cycling and ambient auto-rotation models available, the Toho FLX Thin Film Stress Measurement Systems offer Industry Standard capabilities for mass production and research facilities that demand accurate stress measurements on various films and substrates. Incorporating KLA-Tencor’s patented “Dual Wavelength” technology, Toho FLX Series tools precisely determine and analyze surface stress caused by deposited thin films.
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Manual and automated gauges for control of wafer thickness and geometry

Our capacitive based system can be used in many different applications. Generally, the systems measure distance, displacements and thickness of various materials.
Because of the use of a relatively low carrier frequency, in the case of silicon, there is no influence of the material's resistivity. The systems can be used in the entire range between 0,001 ohm-cm and 1.000 ohm-cm without calibration.

The semiconductor industry is now our biggest customer. Our different gauges can measure the Thickness, TTV, Bow, Warp and Stress.

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Probe Refresher TPR-03

  • suitable for cantilever probecards: probe pitch from 50 µm, tip diameter from 10 microns, probe materials: W, WRe, CuBe, Paliney
  • cleaning/reshaping for vertical probe cards optional
  • reshaping method based on specifically formulated abrasive elastomer pad
  • highly polished probe surfaces after reshaping (surface roughness < 0.3 microns)
  • very good contact resistance after reshaping
  • maintains probecard alignment integrity, no realignment due to reshaping process necessary
  • fully automatic, no specific operator skills required
  • short p
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T.I.P.S

T.I.P.S. mission statement which emphasize on technical innovation, applied physics and electronics gives our customer confidence beeing state of art in measurement technology.

T.I.P.S. is your “one-stop-shop” for semiconductor measurement devices and microchip test interfaces. Based on revolutionary technologies and technical expertise and short manufacturing and maintenance lead time, T.I.P.S. provides full ownership of high yielding microchip test hardware.

http://www.tips.co.at/

 

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VLSI Standards, Inc.

VLSI Standards, Inc. was founded in 1984 in Mountain View, California for the purpose of developing measurement standards and associated services for the semiconductor and metrology related industries. VLSI Standards' first products were a NIST traceable Step Height Standard, and a line of Contamination Standards. Today, in our class I fabrication facility, along with offices in the US and Japan, VLSI Standards provides dozens of standards, products, and services to address every aspect of instrument calibration in the semiconductor and other industries requiring precise metrology.

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