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A dedicated, automated, timesaving, and user-friendly system that enables a total solution for TEM/STEM and SEM sample preparation for both cross-section and plan view in a wide range of applications. Featuring a cryo-cooled dry saw process, the EM3 system prepares specimens of either crystalline or amorphous materials. The output sample is mounted onto a compatible stub that allows rework.




The MC600i is an enhanced version of the award-winning MC600 Microcleaving System. In addition to all the features of the MC600, the MC600i offers increased accuracy, enables cleaving of smaller wafer segments and dies, and allows cleaving as close as 0.5mm to a sample edge.


Toho Technology

Following a long business relationship Toho and KLA-Tencor have officially concluded the next transfer of technology, which has resulted in a long awaited upgrade to KLA-Tencor’s industry standard stress measurement system, the FLX-2320.


FLX2320-S Stress Measurement System

Toho Technology has released a new and improved version, the FLX-2320-S, featuring a new Windows XP operating platform that drives the most reliable bench top stress measurement tool in the industry. The JPK group has been involved in the sales and support of this system since its invention and can provide extensive applications support and training in film stress measurement techniques and the interpretation of thermal behaviour of films.


Manual and automated gauges for control of wafer thickness and geometry

Our capacitive based system can be used in many different applications. Generally, the systems measure distance, displacements and thickness of various materials.
Because of the use of a relatively low carrier frequency, in the case of silicon, there is no influence of the material's resistivity. The systems can be used in the entire range between 0,001 ohm-cm and 1.000 ohm-cm without calibration.

The semiconductor industry is now our biggest customer. Our different gauges can measure the Thickness, TTV, Bow, Warp and Stress.


Probe Refresher TPR-03

  • suitable for cantilever probecards: probe pitch from 50 µm, tip diameter from 10 microns, probe materials: W, WRe, CuBe, Paliney
  • cleaning/reshaping for vertical probe cards optional
  • reshaping method based on specifically formulated abrasive elastomer pad
  • highly polished probe surfaces after reshaping (surface roughness < 0.3 microns)
  • very good contact resistance after reshaping
  • maintains probecard alignment integrity, no realignment due to reshaping process necessary
  • fully automatic, no specific operator skills required
  • short p


T.I.P.S. mission statement which emphasize on technical innovation, applied physics and electronics gives our customer confidence beeing state of art in measurement technology.

T.I.P.S. is your “one-stop-shop” for semiconductor measurement devices and microchip test interfaces. Based on revolutionary technologies and technical expertise and short manufacturing and maintenance lead time, T.I.P.S. provides full ownership of high yielding microchip test hardware.



Probe Card Interface (PCI)

Acting as the interface between the probe card tester and the probe card, the Probe Card Interface (motherboard) is critical in simulating the tester interface on the test floor. Rudolph Technologies' engineers carefully consider probe card, tester, prober, probing process and probe card analyzer configuration details to produce an interface design that will provide precise and consistent measurement results.


PrecisionWoRx™ VX4 Wafer Probe Card Test and Analysis System

The Precision WoRx VX4 System is designed to provide accurate and repeatable performance to meet today’s probe test challenges. With over 500 PrecisionPoint (VX4 predecessor) systems installed around the world, users confidently test tighter pitches and smaller probe tips. It can be easily configured to your specific requirements for a variety of probe card technologies.