Electrical Products
Resistivity Standards
- 76.2 mm, 200 mm, or 300 mm silicon wafers
- Used with 4-Point Probes, Eddy Current Gauges
ITO Sheet Resistance Standards
- 125mm x 125mm x 0.7mm
- 90% In2O3:10% SnO2 plates
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Film Thickness Products
Silicon Dioxide Standards
- Uniform layer of silicon dioxide on silicon wafers
- Used with Ellipsometers, Reflectometers, Film Monitors
Silicon Nitride Standards
- Layer of Silicon Nitride (LPCVD) on silicon wafers
- Used with Ellipsometers, Reflectometers, Film Monitors
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Dimensional Products
NanoCD Standards
- 25, 45, 70 and 110 nm Line Width
- Used with SEMs and CD-AFMs
Nanolattice Standard (NLS)
The NanoLattice Module Standard (NLSM) is a CD SEM calibration standard which enables accurate sub 0.13 μm lithography. The NanoLattice has the 0.1 μm pitch required for sub 0.13 μm SEM magnification calibration and characterization of non-linearity across the field of view.
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Contamination Standards
Absolute Contamination Standards
- Substrate Deposited Polystyrene Latex Spheres
- For use with Scanning Surface Inspection Systems (SSIS)
Edge Contamination Standards
- Edges of Substrate Deposited Polystyrene Latex Spheres
- For use with Edge Contamination Detection Systems
Reticle Contamination Standards
- Spheres deposited on photomasks / test plates
- For use with reticle and pellicle inspection systems
Silica Contamination Standards
- Substrate Deposited highly spherical Silica Spheres
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Improved Standard Video Resolution & Additional Magnification Option Now Available for ASAP-1 IPS Live Machine-Vision Output
A Key Feature of our ASAP-1 IPS System has been the ALWAYS LIVE MACHINE VISION screen which enables the user to make REALTIME processing decisions. This feature is becoming more and more crucial with the move to ever thinner silicon, and the complexities of modern mechanical decapsulation.
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Multiple Customers Select JVS for Inline GaN/Si Process Control
MIGDAL HAEMEK, Israel, July 7, 2014
Jordan Valley Semiconductors Ltd., a leading supplier of X-ray based metrology tools for advanced semiconductor manufacturing lines, today announced that it has recently delivered and successfully commissioned its JVX7300L in-line X-ray metrology tool at multiple customers. The systems have been purchased for in-fab process development and automated production monitoring of GaN on Si wafers.
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JVS Wins More Market Share in Advanced Wafer Level Packaging
MIGDAL HAEMEK, Israel, July 3, 2014
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Our new supplier INSIDIX
We are glad to welcome INSIDIX in our supplier portfolio and look forward to a successful business cooperation!
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Topography and Deformation Measurement (TDM)
TDM is a patented Insidix technology that helps the engineers to increase reliability
of their products from complex packaging and allows Failure Analysis engineers to
understand the root causes of failure observed in operations. The TDM operating
system combines a powerful, internally developed heating/cooling sequence with a
sophisticated optical set up for 3D topography analysis under thermal stress of all
kinds of materials, components & sub-systems. TDM can impose the same thermal
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INSIDIX
Submitted by Anna Schwarz on Wed, 04/30/2014 - 10:56Insidix is a Grenoble based company created in 1996 by Jean-Claude Lecomte, an experienced engineer and innovator, highly regarded as a pioneering expert in high definition non-destructive control systems for the microelectronics industry.
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