Jordan Valley's Delta-X is the latest generation of flexible X-ray diffraction instruments for thin-film materials research, process development, and quality control. Featuring fully automated source optics, the system can switch between standard XRD, High-Resolution, and X-ray reflectivity modes without user intervention. Measurements can be run in partial or fully automated modes, with user-customizable scripts handling the routine work.
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nTact’s proprietary slot die coating technology delivered in a small footprint, affordable platform geared to the R&D and pre-production market. The standard package is designed for the processing of 150 and/or 200mm square substrate sizes with a variety of optional features available for other applications.
The YES-VertaCure automated, high temperature cure series of ovens is designed for today’s most demanding MEMS and semiconductor process applications. Whether it’s for proper curing of multiple layers of polyimide in an RDL (Bond Pad Re-routing) application or annealing copper in an advanced semiconductor device, the YES-VertaCure helps achieve total environmental control to increase yields and extend device performance.
- Extends life, avoids SPC baseline shift
- Assures measurement accuracy
- Layer of Tungsten on silicon wafers
- Used with Optoacoustic and XRD instruments
The FA 2000 Reactive Ion Etch system specializing in the decapsulation and depassivation of packaged devices in an anisotropic manner for the worldwide Semi-Conductor industry
BSET EQ designs and manufactures Gas Plasma Systems Used for Plasma Etching, Plasma Cleaning, Plasma Surface Treatment and Plasma IC Decapsulation for Failure Analysis and IC Counterfeit Detection. These dry processes are environmentally friendly and our systems are used worldwide in an increasing number of industries.
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The ASAP-1 is a well known tool for the preparation of samples for backside imaging and for other routine failure analysis preparation.