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NT Series Planar Electrode Batch Plasma Systems

NT Series vacuum chambers for plasma etching and cleaning for various industries worldwide

Unique Specifications

  • Ability to perform in direct, R.I.E. and downstream plasma modes without tooling change overs
  • Stainless steel chamber for high process cleanliness and system integrity
  • State of the art process controller geared for process development
  • Proprietary add ons & options
  • Available in stand alone or table top




The QC-TT is the latest defect metrology system. It helps identify problems encountered during wafer production using the latest X-ray diffraction imaging (XRDI) technology. Applications include monitoring buried defects to prevent costly wafer breakage during ultra fast anneal. It can qualify and monitor process tools at any technology node, including 90nm and below, which reduces cycle times and facilitates fab expansion.




The QC-RT is the latest defect metrology system. It uses reflection topography to image the surface and first 10-30µm subsurface region for crystalline defects.



The QC-Velox high throughput coupled with excellent repeatability enables fast feedback of the layer quality and structure. This can only be achieved with

  • High throughput measurements
  • Fast, accurate analysis
  • Fast, convenient and user-friendly feedback.

The QC-Velox utilised the latest generation of HRXRD technology to enable the highest throughput on the market for HRXRD, coupled with repeatable data.



The QC3 is the latest model in the long-established and well-proven QC range of High Resolution X-ray diffractometers, with over a 20-year pedigree, and hundreds in use around the world in compound semiconductor and silicon-germanium research and manufacturing facilities. It is a high resolution X-ray diffraction tool that is ideal for semiconductor development and quality control. It is used for the measurement of composition and thickness in epitaxial layers of almost any material.